Taiwan Semiconductor Manufacturing Co. will expand its Arizona footprint with a new advanced chip packaging facility, the company said, as Washington steps up restrictions on high-end artificial intelligence semiconductors bound for China.

The move is designed to support major U.S. customers, including NVIDIA, by bringing more of the chip supply chain onto American soil. Advanced packaging is a key step in producing powerful AI chips, and it has become a strategic focus for both U.S. industrial policy and global tech competition.

The new plant adds to TSMC’s growing investment in the United States, where officials have pushed to reduce dependence on overseas manufacturing for critical technologies. For TSMC, the Arizona expansion also deepens its role in supplying chips for the fast-growing AI market while navigating tighter export rules.

The latest controls reflect an increasingly hard line by the U.S. on technology transfers to China, especially in sectors tied to military and surveillance applications. The policy is likely to keep reshaping supply chains as chipmakers, cloud companies, and hardware designers adjust to a more divided global market.